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专利名称：Process architecture and manufacturing tool
sets employing hard mask patterning foruse in the manufacture of one or moremetallization levels on a workpiece
发明人：E. Henry Stevens,Robert W. Berner申请号：US09/128238申请日：19980803公开号：US061201A公开日：20000919
摘要：A manufacturing tool configuration for applying one or more levels ofinterconnect metallization to a generally planar dielectric surface of a workpiece with aminimal number of workpiece transfer operations between the tool sets is disclosed. Thetool configuration comprises a film deposition tool set, a hard mask formation tool set, ahard mask etching tool set, a pattern processing tool set, a wet processing tool set, anda dielectric processing tool set. The film deposition tool set is used to deposit aconductive barrier layer exterior to the planar dielectric surface of the workpiece and aconductive seed layer exterior to the barrier layer. The hard mask formation tool set isused to form a hard mask dielectric layer exterior to the seed layer in accordance withone of the disclosed processes, and to form a still further hard mask dielectric layerexterior to the hard mask dielectric layer. In accordance with a first disclosed process, thepattern processing tool set is used to provide an interconnect line pattern over the hardmask dielectric layer and to provide a post pattern over interconnect line metallizationformed using the interconnect line pattern. In accordance with a second disclosed
process, the pattern processing tools set is used to provide a post pattern over thefurther hard mask dielectric layer so that the post pattern is ultimately formed in thefurther hard mask dielectric layer. The hard mask etching tool set is used to etch
exposed regions of the hard mask dielectric layer after formation of the interconnect linepattern thereover and, in accordance with the second disclosed process, the exposedportions of the further hard mask dielectric layer after the formation of the post patternthereover. The wet processing tool set performs at least the following wet processingoperations: 1) applying copper metallization, using an electrochemical depositionprocess, into the interconnect line pattern and the post pattern formed by the patternprocessing tool set, 2) removing material applied by the pattern processing tool set toform the interconnect line pattern and the post pattern, 3) removing the hard maskdielectric layer and, if necessary, the further hard mask dielectric layer, and 4) removingportions of the seed layer and the barrier layer that are not overlied by interconnect linemetallization. The dielectric processing tool set is used to deposit a dielectric layer overthe interconnect line metallization and post metallization and for etching the depositeddielectric layer to expose upper connection regions of the post metallization. In
accordance with one embodiment of the tools set architecture, an inspections tools set isalso employed to inspect the workpiece at intermediate stages of the processing.
申请人：SEMITOOL, INC.
代理机构：Rockey, Milnamow & Katz, Ltd.
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