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专利名称：Method for applying adhesives to a lead
frame
发明人：Walter L. Moden,Syed S. Ahmad,Gregory M.
Chapman,Tongbi Jiang
申请号：US09942323申请日：20010829公开号：US06818460B2公开日：20041116
专利附图：
摘要：A method for applying a viscous material to a lead frame element. A method ofthe invention includes positioning the lead frame facing downward and bringing the lead
fingers into contact with a pool of adhesive material. The contact of the lead fingers tothe adhesive material results in a portion of the lead fingers receiving a portion of theadhesive material from the pool of adhesive material. The gravitational forces on theadhesive material on the downward facing lead frame maintain the shape and boundarydefinition of the adhesive material.
申请人：MICRON TECHNOLOGY, INC.
代理机构：TraskBritt
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