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专利名称：Electrode terminal connection structure of
semiconductor module
发明人：Kenichi Sofue,Hiromitsu Yoshiyama,Toshinari
Fukatsu,Toshiaki Nagase
申请号：US093329申请日：19990903公开号：US06380617B1公开日：20020430
专利附图：
摘要：The side of one of the source electrodes and of two semiconductor modulesQand Qcorresponding to a pair of upper and lower arms are installed parallel with the
outer side of the other source electrode inside packages and . Both the modules arearranged parallel to one another in such a way that both the sides are opposed, an inter-module electrode terminal for connecting the source electrode of the module Qand thedrain electrode (base substrate) of the module Qis formed in a block shape, and one endof the inter-module electrode terminal is vertically installed parallel and close to theside of the source electrode on the base substrate of the module Q. A positive electrodeterminal made of a block of a conductive metal is vertically installed so as to beelectrically connected with both the base substrate of the module Qand the lowerpositive electrode of a bus electrode panel parallel and close to the side of the sourceelectrode and to mechanically support the bus electrode panel
申请人：KABUSHIKI KAISHA TOYODA JIDOSHOKKI SEISAKUSHO
代理机构：Morgan & Finnegan, LLP
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