VRBG3312X

www.smdled.com3312X SeriesBi-color φ3 Round Shape TypeFeaturesPackageBi-color φ3 Round shape type, Milky White Diffused epoxy Product features・Outer Dimension φ3 Round shape type・Operation temperature range.Storage Temperature:-30℃～100℃Operating Temperature:-30℃～85℃・Lead–free soldering compatible・RoHScompliantDominant wavelengthGreenYellow GreenRed: 558nm (BG): 567nm (PG): 572nm (PY): 624nm (VR)Half Intensity AngleBG : 67 deg.,PY : deg.,PG : 68 deg.VR : 59 deg.Die materialsRank grouping parameterSoldering methodsESDPackingBG,PG,PY : GaPVR : GaAsPSorted by luminous intensity per rank tapingTTW (Through The Wave) soldering and manual solderingMore than 2kV(HBM)Bulk : 200pcs(MIN.)Recommended ApplicationsAmusement Equipment,Electric Household Appliances, OA/FA, Other General Applications2006.7.31Page 1

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www.smdled.com3312X SeriesBi-color φ3 Round Shape TypeColor and Luminous IntensityDominantWavelengthλd (nm)TYP.IFMIN.(Ta=25℃)Part No.Die NameMaterialEmittedColorLensColorLuminous IntensityIv (mcd)TYP.IFBGVRBG3312XVRPGVRPG3312XVRPYVRPY3312XVRGaPGaAsPGaPGaAsPGaPGaAsPGreenRedGreenRedYellowGreenRedMilkyWhiteMilkyWhiteMilkyWhite558Diffused624567Diffused624572Diffused6242020202020203484681281682020202020202004.10.29Page 2www.smdled.com3312X SeriesBi-color φ3 Round Shape TypeAbsolute Maximum RatingsItemPower DissipationForward CurrentPulse ForwardCurrent ※1Derating(Ta=25℃ or higher)Reverse VoltageOperatingTemperatureStorageTemperatureSymbolPdIFIFRM⊿IFVRToprTstgAbsolute Maximum RatingsBG75301000.334PG75301000.334PY75301000.334VR75301000.334UnitmWmAmAmA/℃V℃℃(Ta=25℃)-30～+85-30～+100※1 IFRM Measurement condition : Pulse Width≦1ms., Duty≦1/20.※The ratings specified above are under the condition that only one diode is lit.50% Max. of each rating shall be applied when two diodesare lit simultaneously.2007.8.31Page 3www.smdled.com3312X SeriesBi-color φ3 Round Shape TypeElectro-Optical Characteristics(Ta=25℃)ItemConditionsSymbolBGTYP.2.12.51005555583067VFMAX.CharacteristicsPG2.12.51005605673068PY2.12.510057057230VR2.0UnitForward VoltageIF=20mAV2.51006306243059μAnmnmnmdeg.Reverse CurrentPeak WavelengthDominantWavelengthSpectral Line HalfWidthHalf IntensityAngleVR=4VIF=20mAIF=20mAIF=20mAIF=20mAIRλpλd⊿λ2θ1/2MAX.TYP.TYP.TYP.TYP.2004.10.29Page 4www.smdled.com3312X SeriesBi-color φ3 Round Shape TypeLuminous Intensity RankIV（mcd）VRPG3312XVRBG3312XPGVRBGVRMIN.MAX.MIN.MAX.MIN.MAX.MIN.MAX.3.06.06.012.04.28.48.416.86.012.012.024.08.416.816.833.612.0-24.0-VRPY3312XPYVRMIN.MAX.MIN.MAX.8.016.011.222.416.032.022.444.832.0-(Ta=25℃)RankConditionABCDEIF = 20mA󰋞Please contact our sales staff concerning rank designation.2004.10.29Page 5www.smdled.com3312X SeriesBi-color φ3 Round Shape TypeTechnical Data(VRBG)Spectral DistributionRelative Intensity vs. WavelengthCondition : Ta = 25℃, IF= 20mA Spatial Distribution ExampleCondition : Ta = 25℃Relative IntensityWavelength[nm]Forward Voltage vs. Forward CurrentCondition : Ta = 25℃Forward Current vs. Relative IntensityCondition : Ta = 25℃Forward Current IF(mA)Forward Voltage VF(V)Relative IntensityForward Current IF(mA)2007.11.6Page 6www.smdled.com3312X SeriesBi-color φ3 Round Shape TypeTechnical Data(VRBG)DeratingAmbient Temperature vs. Maximum Forward CurrentRepetition Frequency : f ≧50HzAmbient Temperature vs. Relative IntensityCondition : IF=20mAMaximum Forward Current : IFMAX. (mA)Ambient Temperature : Ta(℃)Relative IntensityAmbient Temperature : Ta(℃)Ambient Temperature vs. Forward VoltageAmbient Temperature vs. Forward VoltageForward Voltage VF(V)Ambient Temperature : Ta(℃)Forward Voltage VF(V)Ambient Temperature : Ta(℃)2004.10.29Page 7www.smdled.com3312X SeriesBi-color φ3 Round Shape TypeTechnical Data(VRBG)Power Dissipation vs. Ambient TemperatureDynamic Drive RatingDuty cycle vs. Maximum Forward CurrentCondition : Ta = 25℃Maximum Forward Current : IF MAX. (mA)Power Dissipation : Pd (mW)Ambient Temperature : Ta(℃)Duty (%)Pulse Width vs. Maximum Tolerable Peak CurrentCondition : Ta = 25℃IFpeak Max./IFDC MAX.Pulse Width : tw(μs)2004.10.29Page 8www.smdled.com3312X SeriesBi-color φ3 Round Shape TypeTechnical Data(VRPG)Spectral DistributionRelative Intensity vs. WavelengthCondition : Ta = 25℃, IF= 20mA Spatial Distribution ExampleCondition : Ta = 25℃Relative IntensityWavelength[nm]Forward Voltage vs. Forward CurrentCondition : Ta = 25℃Forward Current vs. Relative IntensityCondition : Ta = 25℃Forward Current IF(mA)Forward Voltage VF(V)Relative IntensityForward Current IF(mA)2004.10.29Page 9www.smdled.com3312X SeriesBi-color φ3 Round Shape TypeTechnical Data(VRPG)DeratingAmbient Temperature vs. Maximum Forward CurrentRepetition Frequency : f ≧50HzAmbient Temperature vs. Relative IntensityCondition : IF=20mAMaximum Forward Current : IFMAX. (mA)Ambient Temperature : Ta(℃)Relative IntensityAmbient Temperature : Ta(℃)Ambient Temperature vs. Forward VoltageAmbient Temperature vs. Forward VoltageForward Voltage VF(V)Ambient Temperature : Ta(℃)Forward Voltage VF(V)Ambient Temperature : Ta(℃)2004.10.29Page 10www.smdled.com3312X SeriesBi-color φ3 Round Shape TypeTechnical Data(VRPG)Power Dissipation vs. Ambient TemperatureDynamic Drive RatingDuty cycle vs. Maximum Forward CurrentCondition : Ta = 25℃Maximum Forward Current : IF MAX. (mA)Power Dissipation : Pd (mW)Ambient Temperature : Ta(℃)Duty (%)Pulse Width vs. Maximum Tolerable Peak CurrentCondition : Ta = 25℃IFpeak Max./IFDC MAX.Pulse Width : tw(μs)2004.10.29Page 11www.smdled.com3312X SeriesBi-color φ3 Round Shape TypeTechnical Data(VRPY)Spectral DistributionRelative Intensity vs. WavelengthCondition : Ta = 25℃, IF= 20mA Spatial Distribution ExampleCondition : Ta = 25℃Relative IntensityWavelength[nm]Forward Voltage vs. Forward CurrentCondition : Ta = 25℃Forward Current vs. Relative IntensityCondition : Ta = 25℃Forward Current IF(mA)Forward Voltage VF(V)Relative IntensityForward Current IF(mA)2004.10.29Page 12www.smdled.com3312X SeriesBi-color φ3 Round Shape TypeTechnical Data(VRPY)DeratingAmbient Temperature vs. Maximum Forward CurrentRepetition Frequency : f ≧50HzAmbient Temperature vs. Relative IntensityCondition : IF=20mAMaximum Forward Current : IFMAX. (mA)Ambient Temperature : Ta(℃)Relative IntensityAmbient Temperature : Ta(℃)Ambient Temperature vs. Forward VoltageAmbient Temperature vs. Forward VoltageForward Voltage VF(V)Ambient Temperature : Ta(℃)Forward Voltage VF(V)Ambient Temperature : Ta(℃)2004.10.29Page 13www.smdled.com3312X SeriesBi-color φ3 Round Shape TypeTechnical Data(VRPY)Power Dissipation vs. Ambient TemperatureDynamic Drive RatingDuty cycle vs. Maximum Forward CurrentCondition : Ta = 25℃Maximum Forward Current : IF MAX. (mA)Power Dissipation : Pd (mW)Ambient Temperature : Ta(℃)Duty (%)Pulse Width vs. Maximum Tolerable Peak CurrentCondition : Ta = 25℃IFpeak Max./IFDC MAX.Pulse Width : tw(μs)2004.10.29Page 14www.smdled.com3312X SeriesBi-color φ3 Round Shape TypePackage Dimensions(Unit: mm)2007.10.12Page 15www.smdled.com3312X SeriesBi-color φ3 Round Shape TypeTTW (Through The Wave) solderingConditionsPre-heating Solder Bath Temp.Dipping Time100 ℃265℃5 s(MAX.)(MAX.)(MAX.)1) The dip soldering process shall be 2 times maximum.2) The product shall be cooled to room temp. before the second dipping process.※The detail is described to LED and Photodetector handling precautions of home page: \"Mounting through-hole Type Devices“and \"Soldering\Manual Soldering ConditionsIron tip temp.Soldering time and frequency400℃3 s2 times(MAX.)(MAX.)(MAX.)※The detail is described to LED and Photodetector handling precautions of home page:\"Mounting through-hole Type Devices“and \"Soldering\2006.3.31Page 16www.smdled.com3312X SeriesBi-color φ3 Round Shape TypeReliability Testing ResultReliability TestingResultRoom Temp.Operating LifeResistance toSoldering HeatTemperature CyclingWet High Temp.Storage LifeHigh Temp.Storage LifeLow Temp.Storage LifeLead TensionVibration,Variable FrequencyApplicable StandardEIAJ ED-4701/100(101)EIAJ ED-4701/300(302)EIAJ ED-4701/100(105)EIAJ ED-4701/100(103)EIAJ ED-4701/200(201)EIAJ ED-4701/200(202)EIAJ ED-4701/400(401)EIAJ ED-4701/400(403)Testing ConditionsTa = 25℃, IF = Maxium Rated Current260±5℃, 3mm from package baseMinimum Rated Storage Temperature(30min)～Normal Temperature(15min)～Maximum Rated Storage Temperature(30min)～Normal Temperature(15min)Ta = 60±2℃, RH = 90±5%Ta = Maximum Rated Storage TemperatureTa = Minimum Rated Storage Temperature10N,1time (0.4 and Flat Package : 5N)98.1m/s(10G), 100 ～ 2KHz sweep for 20min.,XYZ each direction2 □Duration1,000 h10sFailure0/250/255 cycles0/251,000 h1,000 h1,000 h10s2 h0/250/250/250/100/10Failure CriteriaItemsLuminous IntensityForward VoltageReverse CurrentCosmetic AppearanceSymbolsIvVFIR-ConditionsIF Value of each productLuminous IntensityIF Value of each productForward VoltageVR = Maximum RatedReverse Voltage V-Failure criteriaTesting Min. Value ＜ Spec. Min. Value x 0.5Testing Max. Value ≧ Spec. Max. Value x 1.2Testing Max. Value ≧ Spec. Max. Value x 2.5Occurrence of notable decoloration,deformation and cracking2007.8.31Page 17www.smdled.com3312X SeriesBi-color φ3 Round Shape TypeSpecial Notice to Customers Using the Products and Technical Information Shown in This Data Sheet1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor thegranting of any license.2) For the purpose of product improvement, the specifications, characteristics and technical data described inthe data sheets are subject to change without prior notice.Therefore it is recommended that the mostupdated specifications be used in your design.3) When using the products described in the data sheets, pleaseadhere to the maximum ratings for operatingvoltage, heat dissipation characteristics, and other precautions for use. We are not responsible for anydamage which may occur if these specifications are exceeded.4) The products that have been described to this catalog are manufactured so that they will be used for theelectrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment andnuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrongoperation might influence the life or the human body. Please consult us beforehand if you plan to use ourproduct for the usages of aircrafts, space borne application, transportation equipment, medical equipmentand nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AVmachine, home appliance and measuring instrument.5) In order to export the products or technologies described inthis data sheet which are under the “Foreign Exchange and Foreign Trade Control Law,”it is necessary to first obtain an export permit from theJapanese government.6) No part of this data sheet may be reprinted or reproduced without prior written permission from StanleyElectric Co., Ltd.7) The most updated edition of this data sheet can be obtained from the address below:http://www.stanley-components.com2007.8.31Page 18