专利内容由知识产权出版社提供
专利名称：Apparatus for electroplating metal films
including a cathode ring, insulator ring andthief ring
发明人：Jane Ang申请号：US08/5508申请日：19951129公开号：US05620581A公开日：19970415
摘要：Multiple-layer thin film devices are deposited by electroplating on an otherwisesubstantially clean substrate wafer. The composition of the electroplated alloy layers ismaintained substantially uniform using a cathode assembly on which the substrate waferis mounted. The cathode assembly includes an inner cathode ring electrically connectedto the wafer, a thief ring external to the cathode ring and an insulating ring connectedbetween and electrically insulating the cathode and thief rings. The cathode ring and thethief ring are powered by separate power sources.
申请人：AIWA RESEARCH AND DEVELOPMENT, INC.
代理机构：Skjerven, Morrill, MacPherson, Franklin & Friel, LP.
更多信息请下载全文后查看
