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专利名称：Pressing sensor and pressure detecting
device
发明人：森 健一申请号：JP20195582申请日：20190530公开号：JP6708315B2公开日：20200610
摘要：The present invention is provided with a reinforcement substrate (21), anadhesive material (22), and a sensor part (23) which is arranged on a first main surface (14)of the substrate (21), with the adhesive material (22) being interposed therebetween. If Eis the elastic modulus of the substrate (21), E is the elastic modulus of the adhesivematerial (22) and E is the elastic modulus of the sensor part (23), E, E and E satisfy E < Eand E < E.
申请人：株式会社村田製作所
地址：京都府長岡京市東神足１丁目１０番１号
国籍：JP
代理人：特許業務法人 楓国際特許事務所
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